CoMeT: Core & Memory Thermal Simulation
We present the first integrated Core and Memory interval thermal simulation toolchain, CoMeT that comprehensively supports thermal simulation of high- and low-density processors corresponding to four different core-memory (integration) configurations: off-chip DDR memory, off-chip 3D memory, 2.5D, and 3D.
Source Code: GitHub Repository
For more details on this project, please visit our project page: CoMeT
Associated Publications:
- Lokesh Siddhu, Rajesh Kedia, Shailja Pandey, Martin Rapp, Anuj Pathania, Jörg Henkel, and Preeti Ranjan Panda, CoMeT: An Integrated Interval Thermal Simulation Toolchain for 2D, 2.5D, and 3D Processor-Memory Systems, ACM Transactions on Architecture and Code Optimization (TACO), 19(3):1-25, September 2022